Semiconductor Specialist

Nuremberg, Germany (Hyrbid)


  • Definition of the application’s important design parameters
  • Analysis of the market for new materials and technologies
  • SiC Mosfets’ internal structure is evaluated
  • Presentation of the findings and technical discussion of them in front of the supplier and the client
  • Analysis using statistics of the individual important parameters
  • Recognise how electrical behaviour is affected by connectivity technologies like sintering and soldering
  • Designing the power modules using thermal-electrical and thermal-mechanical simulations (FEM-ANSYS simulations)
  • Analyze and understand the failure mechanism as well as work out new methods of analysis


  • Ability to work in an international team, customer and quality orientation, problem solving capability
  • Academic degree in electrical engineering or equivalent field of studies
  • Fluent German and English language skills (written and spoken)
  • Understanding of power semiconductor assembly and connecting technologies
  • Skills in networking and communication, as well as in analysis and problem-solving
  • Experience with analysis tools like SAM, lock-in thermography etc
  • Long-term experience in the automotive electronics industry
  • Knowledge of the FMEA technique
  • Good knowledge of MS Office applications
  • Knowledge of the internal structure of power semiconductors

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    Advertised By:

    Louie Bergonzi
    Consultant - E-Mobility

    Email Consultant
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